Document is current

Any future updates will be listed below

Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules

Crossref DOI link: https://doi.org/10.1007/s10854-020-05080-1

Published Online: 2021-01-04

Published Print: 2021-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark