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Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering

Crossref DOI link: https://doi.org/10.1007/s10854-020-05086-9

Published Online: 2021-01-02

Published Print: 2021-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Huang, H. J.

Wu, X.

Zhou, M. B.

Zhang, X. P. https://orcid.org/0000-0002-5181-4026
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51775195, 51405162)

Research Fund for Science & Technology Planning Project of Guangzhou City (201807010028)
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Text and Data Mining valid from 2021-01-02

Version of Record valid from 2021-01-02
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Article History

Received: 4 November 2020

Accepted: 10 December 2020

First Online: 2 January 2021

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