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Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints

Published Online: 2021-01-12

Published Print: 2021-02

Authors

Hanim, M. A. Azmah

Dasan, Anusha Baradi

Dele-Afolabi, T. T. https://orcid.org/0000-0003-0187-9208
Ariga, Tadashi

Vidyatharran, K.
Funding

Funding for this research was provided by:

Universiti Putra Malaysia (UPM/GP-IPB/2020/9688700)
License Information

Text and Data Mining valid from 2021-01-12

Version of Record valid from 2021-01-12
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Article History

Received: 20 September 2020

Accepted: 24 December 2020

First Online: 12 January 2021

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