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Reliability and strength of Cu–Sn0.5CuZnAl–Cu TLP bonded joints during thermal cycling

Published Online: 2021-06-26

Published Print: 2021-07

Authors

Sun, Lei https://orcid.org/0000-0003-0261-0673
Zhang, Yi

Zhang, Liang

Chen, Cong-ping
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51875053)

Six Talent Peaks Project in Jiangsu Province (XCL022)

State Key Laboratory of Advanced Welding and Joining (AWJ-19Z04)
License Information

Text and Data Mining valid from 2021-06-26

Version of Record valid from 2021-06-26
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Article History

Received: 5 May 2021

Accepted: 18 June 2021

First Online: 26 June 2021

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