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Interfacial adhesion energies of Ru–Mn direct plateable diffusion barriers prepared by atomic layer deposition for advanced Cu interconnects

Crossref DOI link: https://doi.org/10.1007/s10854-021-06567-1

Published Online: 2021-07-10

Published Print: 2021-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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