Recent advances on SnBi low-temperature solder for electronic interconnections
Crossref DOI link: https://doi.org/10.1007/s10854-021-06820-7
Published Online: 2021-08-26
Published Print: 2021-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiang, Nan
Zhang, Liang http://orcid.org/0000-0003-3757-7009
Gao, Li-Li
Song, Xiao-Guo
He, Peng
Funding for this research was provided by:
state key laboratory of advanced welding and joining (AWJ-19Z04)
Text and Data Mining valid from 2021-08-26
Version of Record valid from 2021-08-26
Article History
Received: 14 June 2021
Accepted: 12 August 2021
First Online: 26 August 2021