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Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging

Crossref DOI link: https://doi.org/10.1007/s10854-021-06936-w

Published Online: 2021-09-06

Published Print: 2021-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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