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Main application limitations of lead-free composite solder doped with foreign reinforcements

Published Online: 2021-09-14

Published Print: 2021-10

Authors

Chen, Guang

Wu, Yaofeng https://orcid.org/0000-0002-6519-9693
Funding

Funding for this research was provided by:

National Nature Science Foundation of China (61804135)

Natural Science Foundation of Zhejiang Province of China (LGG21F040002, LQ17E050004)

Postdoctoral Science Foundation of China (2019M652567)
License Information

Text and Data Mining valid from 2021-09-14

Version of Record valid from 2021-09-14
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Article History

Received: 7 May 2021

Accepted: 29 August 2021

First Online: 14 September 2021

Document is current