Effect of Ni on the Au embrittlement in Sn/Au/Ni solder bump
Crossref DOI link: https://doi.org/10.1007/s10854-021-07222-5
Published Online: 2021-10-20
Published Print: 2021-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Tao
Li, Hailong http://orcid.org/0000-0002-6194-3737
Hao, Shiguang
Zhang, Xuehong
Text and Data Mining valid from 2021-10-20
Version of Record valid from 2021-10-20
Article History
Received: 10 September 2021
Accepted: 11 October 2021
First Online: 20 October 2021