Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging
Crossref DOI link: https://doi.org/10.1007/s10854-021-07435-8
Published Online: 2021-12-02
Published Print: 2022-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Barik, El Mostafa
Gillot, Charlotte
Hodaj, Fiqiri http://orcid.org/0000-0001-5004-2274
Text and Data Mining valid from 2021-12-02
Version of Record valid from 2021-12-02
Article History
Received: 2 September 2021
Accepted: 18 November 2021
First Online: 2 December 2021