Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors
Crossref DOI link: https://doi.org/10.1007/s10854-021-07551-5
Published Online: 2022-01-20
Published Print: 2022-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gao, Yue
Xiao, Yu-bo
Liu, Zhi-Quan http://orcid.org/0000-0001-7097-8977
Liu, Yang
Sun, Rong
Text and Data Mining valid from 2022-01-20
Version of Record valid from 2022-01-20
Article History
Received: 25 August 2021
Accepted: 7 December 2021
First Online: 20 January 2022