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Microstructure and properties of Al-Si/Al-SiCp bilayer composite for electronic packaging

Published Online: 2022-02-25

Published Print: 2022-04

Authors

Zhou, Wei

Wang, Richu

Peng, Chaoqun

Cai, Zhiyong https://orcid.org/0000-0002-4926-8441
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51804349)

China Postdoctoral Science Foundation (2018M632986)

Natural Science Foundation of Hunan Province (2019JJ50766)

Postdoctoral Science Foundation of Central South University

Science and Technology Program of Hunan Province (2020GK2044)
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Text and Data Mining valid from 2022-02-25

Version of Record valid from 2022-02-25
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Article History

Received: 19 October 2021

Accepted: 12 February 2022

First Online: 25 February 2022

Declarations

:

: The authors have no relevant financial or non-financial interest to disclose.

: This article does not contain any studies with human participants or animals performed by any of the authors.

: All data, models, and code generated or used during the study appear in the submitted article.

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