Crossmark

Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints

Published Online: 2022-02-26

Published Print: 2022-04

Authors

Lee, Dong-Hwan

Jeong, Min-Seong

Yoon, Jeong-Won https://orcid.org/0000-0001-8708-542X
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2021R1A2C1009714)

Korea Institute for Advancement of Technology (P0008458)
License Information

Text and Data Mining valid from 2022-02-26

Version of Record valid from 2022-02-26
More Information

Article History

Received: 14 January 2022

Accepted: 15 February 2022

First Online: 26 February 2022

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

: This manuscript has not been published or presented elsewhere in part or in entirety and is not under consideration by another journal.

Document is current