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Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration

Crossref DOI link: https://doi.org/10.1007/s10854-022-08018-x

Published Online: 2022-04-01

Published Print: 2022-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Huang, Jiaqiang http://orcid.org/0000-0003-0841-1085
Wang, Xudong

Chen, Junyu

Wei, Weichun

Liu, Fengmei

Qin, Binhao

Wang, Haiyan

Zhang, Yupeng
Funding

Funding for this research was provided by:

GDAS Special Project of Science and Technology Development (2020GDASYL-20200402006)

GDAS Special Project of Science and Technology Development (2022GDASZH-2022010109)

National Key Research and Development Program of China (2020YFE0205300)

Natural Science Foundation of Guangxi Province (AD19245093, 2019GXNSFAA245059)

Middle-aged and Young Teachers' Basic Ability Promotion Project of Guangxi (2019KY0221)
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Article History

Received: 5 January 2022

Accepted: 28 February 2022

First Online: 1 April 2022

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

: This article does not contain any studies with human tissues or animals performed by any of the authors.

: This research is not related to human subjects.

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