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On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu–Sn solder joints

Published Online: 2022-03-18

Published Print: 2022-05

Authors

Han, Xu https://orcid.org/0000-0001-7015-8055
Li, Xiaoyan

Ji, Gang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51975013)
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Text and Data Mining valid from 2022-03-18

Version of Record valid from 2022-03-18
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Article History

Received: 30 December 2021

Accepted: 16 February 2022

First Online: 18 March 2022

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

: The research does not involve human participants and animals.

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