Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages
Crossref DOI link: https://doi.org/10.1007/s10854-022-08079-y
Published Online: 2022-03-27
Published Print: 2022-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Dong-hun
Jang, Jae-il
Kim, Young-Ho http://orcid.org/0000-0003-2738-5433
Text and Data Mining valid from 2022-03-27
Version of Record valid from 2022-03-27
Article History
Received: 1 December 2021
Accepted: 13 March 2022
First Online: 27 March 2022
Declarations
:
: The authors declare no conflict of interest.