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Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device

Published Online: 2022-04-25

Published Print: 2022-06

Authors

Xiao, Yu-bo

Gao, Yue

Liu, Zhi-Quan http://orcid.org/0000-0001-7097-8977
Sun, Rong

Liu, Yang
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Text and Data Mining valid from 2022-04-25

Version of Record valid from 2022-04-25
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Article History

Received: 21 January 2022

Accepted: 6 April 2022

First Online: 25 April 2022

Declarations

:

: The article does not have a conflict of interest with any other unit, institution or any individual.

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