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Authors
Dong, KaiJie
Yang, ZhaoKun
Shi, DongJian
Chen, MingQing https://orcid.org/0000-0002-4207-8696
Dong, Weifu
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Funding
Funding for this research was provided by:
the National Nature Science Foundation of China (21571084)
the Natural Science Foundation of Jiangsu Province (BK20181349)
National First-Class Discipline Program of Light Industry Technology and Engineering (LIFE2018-19)
MOE & SAFEA for the 111 Project (B13025)
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Article History
Received: 23 December 2021
Accepted: 16 April 2022
First Online: 11 May 2022
Declarations
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: The authors abide by ethical standards and are funded by the project fund (listed in <b>Acknow***</b>). The authors demonstrate that there is no conflict of interest between their current work and any individual/organization. All authors agreed to submit to the original article in “<i>Journal of Materials Science: Materials in Electronics</i>”. The authors claim that none of the materials in this manuscript has been published or is under consideration for publication elsewhere. All data generated and analyses during this study are included in this published article and its supplementary material. The data that support the finding of this study are available from the corresponding author upon reasonable request.
