Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints
Crossref DOI link: https://doi.org/10.1007/s10854-022-08605-y
Published Online: 2022-07-07
Published Print: 2022-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Son, Kirak http://orcid.org/0000-0003-1354-1060
Oh, Aesun
Park, Eunyoung
Bae, Hyun-Cheol
Text and Data Mining valid from 2022-07-07
Version of Record valid from 2022-07-07
Article History
Received: 23 February 2022
Accepted: 15 June 2022
First Online: 7 July 2022
Declarations
:
: The authors claim no conflicts of interest.