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Authors
Bai, Ni
Qi, Yongchao
Sun, Zhiyong
Guo, Dandan
Chen, Guilin
Wang, Aimin https://orcid.org/0000-0002-3634-3166
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Funding
Funding for this research was provided by:
YLU-DNL fund (2021002)
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Article History
Received: 28 April 2022
Accepted: 29 June 2022
First Online: 18 July 2022
Declarations
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: We declare that we have no financial and personal relationships with other people or organizations that can inappropriately influence our work. There is no personal or financial conflict of interest.
: Hereby, we declare that the manuscript is our original work and have not been published or under editorial considerations anywhere else. The stated authors of the work have read the content and approved for submission of this manuscript to Journal of Materials Science: Materials in Electronics. There is no personal or financial conflict of interest. Further if our article has been accepted, we ensure that we will not publish it anywhere else in any form, in any language without getting consent of the publisher.
