Funding for this research was provided by:
National Natural Science Foundation of China (U1966212)
National Natural Science Foundation of China (51922075)
Tianjin Municipal Science and Technology Bureau (21JCJQJC00150)
Article History
Received: 4 April 2022
Accepted: 31 July 2022
First Online: 13 August 2022
Declarations
:
: There is no conflict to declare.
: Not applicable.
: Not applicable.
: All the authors listed consented for the submission of the manuscript to Journal of Materials Science: Materials in Electronics.