Light-weight and flexible Ni-doped CuO (Ni:CuO) thin films grown using the cost-effective SILAR method for future technological requests
Crossref DOI link: https://doi.org/10.1007/s10854-022-09139-z
Published Online: 2022-09-23
Published Print: 2022-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Aydın, R.
Akkaya, A. http://orcid.org/0000-0002-4086-6365
Şahin, B.
Text and Data Mining valid from 2022-09-23
Version of Record valid from 2022-09-23
Article History
Received: 13 July 2022
Accepted: 12 September 2022
First Online: 23 September 2022
Declarations
:
: The authors have no relevant financial or non-financial interests to disclose.