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Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging

Published Online: 2022-10-29

Published Print: 2022-12

Authors

Barik, El Mostafa https://orcid.org/0000-0002-5524-3304
Gillot, Charlotte

Hodaj, Fiqiri
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Text and Data Mining valid from 2022-10-29

Version of Record valid from 2022-10-29
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Article History

Received: 2 July 2022

Accepted: 10 October 2022

First Online: 29 October 2022

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

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