A hybrid additive with both suppressor and leveler capability for damascene copper electrodeposition
Crossref DOI link: https://doi.org/10.1007/s10854-022-09606-7
Published Online: 2023-01-20
Published Print: 2023-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Junye
Lu, Guanbin
Zhang, Yuan
Cheng, Yuanrong
Xiao, Fei http://orcid.org/0000-0003-2075-8823
Text and Data Mining valid from 2023-01-01
Version of Record valid from 2023-01-01
Article History
Received: 10 October 2022
Accepted: 21 November 2022
First Online: 20 January 2023
Declarations
:
: There is no conflict of interest to declare.