Low-cost hybrid bonding between thermoplastics and PDMS with differential adhesive tape for microfluidic devices
Crossref DOI link: https://doi.org/10.1007/s10854-023-09998-0
Published Online: 2023-02-16
Published Print: 2023-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Yusheng
Wang, Xiaoyang
Wang, Yaohua
Fan, Yiqiang http://orcid.org/0000-0003-4758-7809
Text and Data Mining valid from 2023-02-01
Version of Record valid from 2023-02-01
Article History
Received: 4 November 2022
Accepted: 30 January 2023
First Online: 16 February 2023
Declarations
:
: The authors have no conflicts of interest to declare that are relevant to the content of this article.