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Article History

Received: 13 October 2022

Accepted: 14 March 2023

First Online: 4 April 2023

Declarations

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: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

: I Ekene Gabriel Okafor on behalf of the authors’, consciously assure that the manuscript entitled laminated transient liquid phase preform and bond characterization for high temperature power electronics application, is the authors’ own original work, which has not been previously published or currently being considered for publication elsewhere. The paper reflects the authors’ own research and analysis in a truthful and complete manner. Meaningful contributions of co-authors and co-researchers are clearly stated. The results are appropriately placed in the context of prior and existing research. All sources used are properly cited. All authors have been personally and actively involved in substantial work leading to the paper, and will take public responsibility for its content. I agree with the above statements and declare that this submission follows the policies of Journal of Materials Science: Materials in Electronics as outlined in the submission guidelines and in the Compliance with Ethical Standards.