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Study of tensile properties, electrothermal characteristics and packaging reliability on Cu–Pt–Au–Pd fine micro-alloyed wire

Published Online: 2023-05-11

Published Print: 2023-05

Authors

Hsu, Shen-Teng

Hung, Fei-Yi https://orcid.org/0000-0001-5432-0980
Wu, Bo-Ding
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Text and Data Mining valid from 2023-05-01

Version of Record valid from 2023-05-01
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Article History

Received: 4 February 2023

Accepted: 3 May 2023

First Online: 11 May 2023

Declarations

:

: The authors declare that there are no competing interests associated with the research presented in the submitted manuscript. The authors have no financial, personal, or professional conflicts of interest that could influence the objectivity, integrity, or impartiality of the research findings.

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