A novel approach of fabricating low-cost high temperature printed circuit board substrate based on poly(ether-ketone)/fly ash composites
Crossref DOI link: https://doi.org/10.1007/s10854-023-10634-0
Published Online: 2023-05-28
Published Print: 2023-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kumar, Mukesh
Kumar, A.
Goyal, R. K. http://orcid.org/0000-0001-7096-3468
Sharma, S.
Text and Data Mining valid from 2023-05-01
Version of Record valid from 2023-05-01
Article History
Received: 8 January 2023
Accepted: 14 May 2023
First Online: 28 May 2023
Declarations
:
: The authors declare that they have no known potential conflict of interest.