Synthesis and characterization of Sn–Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion
Crossref DOI link: https://doi.org/10.1007/s10854-023-10783-2
Published Online: 2023-07-01
Published Print: 2023-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Karimi, Ali
Maleki, Ali http://orcid.org/0000-0002-6773-4346
Taherizadeh, Aboozar
Niroumand, Behzad
Text and Data Mining valid from 2023-07-01
Version of Record valid from 2023-07-01
Article History
Received: 30 April 2023
Accepted: 3 June 2023
First Online: 1 July 2023
Declarations
:
: The author declared that there is no conflict of interest.