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Synthesis and characterization of Sn–Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion

Published Online: 2023-07-01

Published Print: 2023-07

Authors

Karimi, Ali

Maleki, Ali https://orcid.org/0000-0002-6773-4346
Taherizadeh, Aboozar

Niroumand, Behzad
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Text and Data Mining valid from 2023-07-01

Version of Record valid from 2023-07-01
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Article History

Received: 30 April 2023

Accepted: 3 June 2023

First Online: 1 July 2023

Declarations

:

: The author declared that there is no conflict of interest.

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