Transient liquid phase infiltration bonding of copper using porous silver insert sheet
Crossref DOI link: https://doi.org/10.1007/s10854-023-10895-9
Published Online: 2023-07-07
Published Print: 2023-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fukumoto, Shinji http://orcid.org/0000-0002-6236-5289
Yagane, Ryota
Matsushima, Michiya
Funding for this research was provided by:
JSPS KAKENHI (21H01636)
Text and Data Mining valid from 2023-07-01
Version of Record valid from 2023-07-01
Article History
Received: 18 May 2023
Accepted: 22 June 2023
First Online: 7 July 2023
Declarations
:
: The authors declare that they have no conflict of interest.