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Rapid Cu–Cu bonding by pressure-sintering of anti-oxidized Cu nanoparticle pastes under ambient atmosphere

Published Online: 2023-08-16

Published Print: 2023-08

Authors

Yuan, Yulei

Zhang, Minghui

Li, Junjie

Liu, Zhi-Quan https://orcid.org/0000-0001-7097-8977
Funding

Funding for this research was provided by:

Shenzhen Basic Research Plan (JCYJ20190807154409372)

Innovative Research Group Project of the National Natural Science Foundation of China (51805197)
License Information

Text and Data Mining valid from 2023-08-01

Version of Record valid from 2023-08-01
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Article History

Received: 18 May 2023

Accepted: 2 August 2023

First Online: 16 August 2023

Declarations

:

: There is no conflict of interest to declare.

: The work described in this manuscript was original research that has not been published previously, and not under consideration for publication elsewhere, in whole or in part.

: Informed consent was obtained from all individual participants included in the study.

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