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Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers

Published Online: 2023-09-28

Published Print: 2023-09

Authors

Ha, Min Jeong

Lee, Jeong Il

Kim, Jong-Min

Yim, Byung-Seung https://orcid.org/0000-0001-9859-8925
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Text and Data Mining valid from 2023-09-01

Version of Record valid from 2023-09-01
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Article History

Received: 13 April 2023

Accepted: 12 September 2023

First Online: 28 September 2023

Declarations

:

: The authors declare no known competing financial interests or personal relationships that can influence the work reported in this paper.

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