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Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review

Crossref DOI link: https://doi.org/10.1007/s10854-023-11388-5

Published Online: 2023-10-23

Published Print: 2023-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Gan, Chong Leong https://orcid.org/0000-0002-2951-1192
Chung, Min-Hua https://orcid.org/0009-0009-0319-5660
Lin, Lu-Fu

Huang, Chen-Yu https://orcid.org/0000-0003-3691-8027
Takiar, Hem
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Text and Data Mining valid from 2023-10-01

Version of Record valid from 2023-10-01
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Article History

Received: 1 August 2023

Accepted: 21 September 2023

First Online: 23 October 2023

Declarations

:

: No potential conflict of interest was reported by the author(s).

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