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A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints

Published Online: 2023-10-06

Published Print: 2023-10

Authors

Jeong, Min-Seong

Heo, Min-Haeng

Kim, Jungsoo

Yoon, Jeong-Won https://orcid.org/0000-0001-8708-542X
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2021R1A2C1009714)

National Research Foundation of Korea (RS-2023-00247545)
License Information

Text and Data Mining valid from 2023-10-01

Version of Record valid from 2023-10-01
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Article History

Received: 19 July 2023

Accepted: 2 October 2023

First Online: 6 October 2023

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

: This manuscript has not been published or presented elsewhere in part or in its entirety and is not under consideration by another journal.

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