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Coefficient of thermal expansion and thermal conductivity of poly(ether-ketone)–silica nanocomposites for electronic packaging substrate

Published Online: 2023-12-11

Published Print: 2023-12

Authors

Joshi, Mandar

Gadve, Roshan

Upadhyay, Gautam

Goyal, R. K. https://orcid.org/0000-0001-7096-3468
License Information

Text and Data Mining valid from 2023-12-01

Version of Record valid from 2023-12-01
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Article History

Received: 15 November 2023

Accepted: 26 November 2023

First Online: 11 December 2023

Declarations

:

: The authors declare that they do not have known potential conflict of interest.

: Not applicable.

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