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Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization

Crossref DOI link: https://doi.org/10.1007/s10854-024-12067-9

Published Online: 2024-02-07

Published Print: 2024-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhang, Qingke https://orcid.org/0000-0002-8324-9762
An, Chenwei

Song, Zhenlun
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52001317)

“Scientific and Technological Innovation 2025” Major Special Project of Ningbo City (2021Z049, 2020Z039)
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Text and Data Mining valid from 2024-02-01

Version of Record valid from 2024-02-01
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Article History

Received: 4 January 2024

Accepted: 23 January 2024

First Online: 7 February 2024

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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