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Transient liquid phase bonding method of SnIn for high-temperature packaging

Published Online: 2024-07-01

Published Print: 2024-07

Authors

Wang, Jianhao https://orcid.org/0009-0002-6734-4011
Yao, Yuyuan

Jin, Haibin

Wang, Shuiqing
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Text and Data Mining valid from 2024-07-01

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Article History

Received: 24 May 2024

Accepted: 23 June 2024

First Online: 1 July 2024

Declarations

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: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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