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Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

Crossref DOI link: https://doi.org/10.1007/s10854-024-13132-z

Published Online: 2024-07-04

Published Print: 2024-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Heo, Min-Haeng

Seo, Young-Jin

Yoon, Jeong-Won https://orcid.org/0000-0001-8708-542X
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2021R1A2C1009714, RS-2023-00247545)

Korea Institute for Advancement of Technology (P0008458)
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Text and Data Mining valid from 2024-07-01

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Article History

Received: 11 March 2024

Accepted: 1 July 2024

First Online: 4 July 2024

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

: This manuscript has not been published or presented elsewhere in part or in its entirety and is not under consideration by another journal.

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