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Effects of Mo nanoparticles on growth of compounds layer and strength of Sn3.0Ag0.5Cu/Cu solder joint during thermal cycling

Published Online: 2024-07-25

Published Print: 2024-07

Authors

Ma, Shiran

Yang, Linmei https://orcid.org/0000-0001-6530-6287
Yang, Jiyou

Liang, Yawei
Funding

Funding for this research was provided by:

Educational Department of Liaoning Province (LJKZ0158)
License Information

Text and Data Mining valid from 2024-07-01

Version of Record valid from 2024-07-01
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Article History

Received: 21 February 2024

Accepted: 16 July 2024

First Online: 25 July 2024

Declarations

:

: The authors have no conflicts of relevant interests.

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