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Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Published Online: 2024-09-07

Published Print: 2024-09

Authors

Chen, Wenjing https://orcid.org/0009-0007-6537-3800
Hu, Xiaowu

Tang, Jiancheng
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52165047)

National Natural Science Foundation of China (52361009)
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Text and Data Mining valid from 2024-09-01

Version of Record valid from 2024-09-01
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Article History

Received: 31 May 2024

Accepted: 21 August 2024

First Online: 7 September 2024

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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