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The role of Ni minor additions on the mechanical characteristics of Sn-1.5Ag-0.5 wt.% Cu (SAC155) Pb-free solder alloy

Published Online: 2024-11-16

Published Print: 2024-11

Authors

Eid, E. A. https://orcid.org/0000-0002-2194-222X
Fawzy, A.

Mansour, M. M.

Saad, G.

Amin, M.
Funding

Funding for this research was provided by:

Higher Technological Institute 10th of Ramadan
License Information

Text and Data Mining valid from 2024-11-01

Version of Record valid from 2024-11-16
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Article History

Received: 14 April 2024

Accepted: 6 November 2024

First Online: 16 November 2024

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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