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Challenges and progress in packaging materials for power modules with high operation temperature: Review

Published Online: 2024-12-09

Published Print: 2024-12

Authors

Zhao, Shilin https://orcid.org/0009-0006-3540-9668
Tong, Yan

Wang, Chunbiao

Yao, Erxian
Funding

Funding for this research was provided by:

Science and Technology Project of State Grid (5500-202340666A-3-3-JC)
License Information

Text and Data Mining valid from 2024-12-01

Version of Record valid from 2024-12-01
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Article History

Received: 14 July 2024

Accepted: 27 November 2024

First Online: 9 December 2024

Declarations

:

: There is no conflict of interest to declare.

: The work described in this manuscript was review work that has not been published previously, and not under consideration for publication elsewhere, in whole or in part.

: Informed consent was obtained from all individual participants included in the study.

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