Crossmark

Interfacial microstructure in the reaction between BiIn solder and Cu substrate

Published Online: 2024-12-25

Published Print: 2025-01

Authors

Wang, Yi-Wun https://orcid.org/0000-0003-1154-7725
Lin, Tzu-Yi

Tsai, Cheng-Ting
Funding

Funding for this research was provided by:

National Science and Technology Council (111-2221-E-032-019-MY3)
License Information

Text and Data Mining valid from 2024-12-25

Version of Record valid from 2024-12-25
More Information

Article History

Received: 29 October 2024

Accepted: 16 December 2024

First Online: 25 December 2024

Declarations

:

: The authors declare no conflicts of interest.

Document is current