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Growth kinetics of interfacial intermetallic layer of In-48Sn/Cu solder joint by transient liquid phase bonding

Published Online: 2025-01-09

Published Print: 2025-01

Authors

Zhang, Yaocheng https://orcid.org/0000-0001-7201-6368
Liu, Zheng

Meng, Tao

Lu, Kaijian

Yang, Li
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52165068)

Natural Science Foundation of Guangdong Province (2024A1515012861)
License Information

Text and Data Mining valid from 2025-01-01

Version of Record valid from 2025-01-01
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Article History

Received: 17 September 2024

Accepted: 26 December 2024

First Online: 9 January 2025

Declarations

:

: The authors declare that they have no conflict of interest.

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