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Correction: Research on vibration reliability of solder joint based on modal experiment of PCBA

Crossref DOI link: https://doi.org/10.1007/s10854-025-14217-z

Published Online: 2025-01-21

Published Print: 2025-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liu, Fang https://orcid.org/0000-0002-7453-0413
Gong, Runze

Duan, Zhongwei

Wang, Zhen

Zhou, Jiacheng
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First Online: 21 January 2025

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