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The effect of different metal pad sizes on shear stress in solder ball bonding

Published Online: 2025-02-20

Published Print: 2025-02

Authors

Kim, Kyoungrae

Kim, Yekyung

Kang, Sungho

Park, Tae Hoon https://orcid.org/0000-0002-3757-7933
Funding

Funding for this research was provided by:

Ministry of Trade, Industry and Energy (20021828)

Seoul National University
License Information

Text and Data Mining valid from 2025-02-01

Version of Record valid from 2025-02-20
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Article History

Received: 29 August 2024

Accepted: 9 February 2025

First Online: 20 February 2025

Declarations

:

: The authors have no competing interests to declare that are relevant to the content of this article.

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