Crossmark

Pressureless Cu@Ag sintering process with formic acid reducing agent for improved bonding of power semiconductors

Published Online: 2025-03-25

Published Print: 2025-03

Authors

Jeon, Myeonghyeon

Kim, Dajung

Oh, Chulmin https://orcid.org/0000-0003-4609-9408
License Information

Text and Data Mining valid from 2025-03-01

Version of Record valid from 2025-03-01
More Information

Article History

Received: 22 December 2024

Accepted: 9 March 2025

First Online: 25 March 2025

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Document is current