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Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems

Published Online: 2025-04-21

Published Print: 2025-04

Authors

Kang, Jiwan

Sharma, Ashutosh https://orcid.org/0000-0003-0413-4623
Jung, Jae Pil
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Text and Data Mining valid from 2025-04-01

Version of Record valid from 2025-04-01
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Article History

Received: 10 December 2024

Accepted: 23 March 2025

First Online: 21 April 2025

Declarations

:

: The authors declare no conflict of interests.

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