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Authors
Mei, Rui
Yan, Feng
Hu, Sizheng
Gong, Zonggui
Guo, Haoxuan
Wang, Qijing
Zheng, Xinghua https://orcid.org/0000-0002-3423-1064
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Funding
Funding for this research was provided by:
the Opening Testing Funds for the Valuable Equipment of Fuzhou University (No. 2023T008)
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Article History
Received: 11 February 2025
Accepted: 4 April 2025
First Online: 21 April 2025
Declarations
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: The authors have no relevant financial or non-financial interests to disclose.
: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper. All authors have read and approved the submission of this paper for consideration for publication in the Journal of Materials Science: Materials in Electronics.
