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Authors
Wang, Fenghua
Li, Zhibao
Shang, Junpeng
Ma, Chao
Sun, Zeyu
Shen, Baoguo
Zheng, Yingying
Zhang, Shuai
Yao, Shanshan https://orcid.org/0000-0001-8576-7507
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Funding
Funding for this research was provided by:
2024 Academic Research Project of Jiangsu Aviation Technical College (JATC24010116)
Senior Talent Foundation of Jiangsu University (15JDG014)
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Article History
Received: 14 November 2024
Accepted: 8 May 2025
First Online: 22 May 2025
Declarations
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: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
: To ensure objectivity and transparency in research and to ensure that accepted principles for ethical and professional conduct have followed, the authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper. The research did not involve human participants and/or animals. All authors agree to submit the paper to Journal of Materials Science: Materials in Electronics.
